HOME     |     Sitemap     |     繁體     |     简体     |     ENGLISH
HOME ProductsElectronics-related plating
Electronics-related plating
Chemicals for printed-wiring boards  »  Acid copper plating process for via-filling
CU-BRITE VF process
The CU-BRITE VF process is a bright acid copper plating process developed for forming fine interconnections and via filling of buildup PWBs and is applicable to both pattern and panel plating.

CU-BRITE VF

Excellent filling performance of via holes (best suited for the panel plating).


CU-BRITE VFⅡ 

 Excellent throwing power in through holes.



CU-BRITE VFⅢ

Excellent via-filling performance in pattern plating for PWBs with via holes of small diameter and excellent uniformity in film thickness in both densely and sparsely patterned areas.

 
 
Sparse(μm
Dense(μm
Dense/sparse
 VF
20.1
17.8
0.89
 VF
25.7
17.8
0.69
 
Copyright © JCU TAIWAN CORPORATION All Rights Reserve. Design by GRNET.